Thursday, April 12, 2007
Singularity watch:
IBM learns how to make 3D chips, it's 4th major development this year, keeping Moore's Law running along indefinitely.
.
December, IBM announced the first 45nm chips using immersion lithography and ultra-low-K interconnect dielectrics.
In January, IBM and Intel separately announced “high-k metal gate,” which substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties, while allowing the size of the transistor to be shrunk beyond limits being reached today.
In February,IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).
Then in March, IBM unveiled a prototype optical transceiver chipset capable of reaching speeds at least eight-times faster than optical components available today.
IBM learns how to make 3D chips, it's 4th major development this year, keeping Moore's Law running along indefinitely.
.
December, IBM announced the first 45nm chips using immersion lithography and ultra-low-K interconnect dielectrics.
In January, IBM and Intel separately announced “high-k metal gate,” which substitutes a new material into a critical portion of the transistor that controls its primary on/off switching function. The material provides superior electrical properties, while allowing the size of the transistor to be shrunk beyond limits being reached today.
In February,IBM revealed a first-of-its-kind, on-chip memory technology that features the fastest access times ever recorded in eDRAM (embedded dynamic random access memory).
Then in March, IBM unveiled a prototype optical transceiver chipset capable of reaching speeds at least eight-times faster than optical components available today.
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